Invention Grant
US08856564B2 Method and apparatus for power profile shaping using time-interleaved voltage modulation
有权
使用时间交织电压调制的功率分布整形的方法和装置
- Patent Title: Method and apparatus for power profile shaping using time-interleaved voltage modulation
- Patent Title (中): 使用时间交织电压调制的功率分布整形的方法和装置
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Application No.: US12641916Application Date: 2009-12-18
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Publication No.: US08856564B2Publication Date: 2014-10-07
- Inventor: Peng Zou , Joseph T Dibene, II , Fenardi Thenus
- Applicant: Peng Zou , Joseph T Dibene, II , Fenardi Thenus
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Kacvinsky Daisak Bluni PLLC
- Main IPC: G06F1/32
- IPC: G06F1/32

Abstract:
Embodiments of an apparatus, system and method are described for dynamically time-interleaving supply voltage modulation to shape a power profile. An apparatus may comprise, for example, a power management module to monitor power information received from a plurality of devices and send a power control signal including delay information to each device having power information that exceeds a power threshold, the delay information comprising information for time-interleaving power usage among the devices having power information that exceeds the power threshold. Other embodiments are described and claimed.
Public/Granted literature
- US20110154071A1 METHOD AND APPARATUS FOR POWER PROFILE SHAPING USING TIME-INTERLEAVED VOLTAGE MODULATION Public/Granted day:2011-06-23
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