Invention Grant
- Patent Title: Microarchitecture controller for thin-film thermoelectric cooling
- Patent Title (中): 用于薄膜热电冷却的微体系结构控制器
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Application No.: US13784208Application Date: 2013-03-04
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Publication No.: US08856569B2Publication Date: 2014-10-07
- Inventor: Pedro Chaparro Monferrer , Jose Gonzalez
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Trop, Pruner & Hu, P.C.
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F1/32 ; H01L23/34 ; H01L23/38 ; G05D23/19
Abstract:
A device having multiple cores executes an algorithm to control Thin-Film Thermoelectric Coolers (TFTEC) that employ the Peltier effect to remove heat from the various cores of the multi-core processor. The algorithms may combine Thread Migration (TM) and Dynamic Voltage/Frequency Scaling (DVFS) to provide Dynamic Thermal Management (DTM) and TFTEC control.
Public/Granted literature
- US20130185579A1 Microarchitecture Controller For Thin-Film Thermoelectric Cooling Public/Granted day:2013-07-18
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