Invention Grant
- Patent Title: Three dimensional integrated circuits
- Patent Title (中): 三维集成电路
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Application No.: US13609108Application Date: 2012-09-10
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Publication No.: US08856699B2Publication Date: 2014-10-07
- Inventor: Raminda Udaya Madurawe
- Applicant: Raminda Udaya Madurawe
- Main IPC: G06F17/50
- IPC: G06F17/50 ; H03K19/177 ; H03K19/173
Abstract:
A three-dimensional semiconductor device, comprising: a circuit block located in a first module layer; and a configuration circuit to control the circuit block further comprising a configurable element in a second module layer positioned above the first module layer.
Public/Granted literature
- US20130002296A1 THREE DIMENSIONAL INTEGRATED CIRCUITS Public/Granted day:2013-01-03
Information query
