Invention Grant
- Patent Title: Molded interposer package and method for fabricating the same
- Patent Title (中): 模制插入器封装及其制造方法
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Application No.: US14154564Application Date: 2014-01-14
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Publication No.: US08859340B2Publication Date: 2014-10-14
- Inventor: Thomas Matthew Gregorich , Andrew C. Chang , Tzu-Hung Lin
- Applicant: MediaTek Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/44 ; H01L23/52 ; H01L23/498 ; H01L21/56 ; H01L25/065 ; H01L25/10 ; H01L23/367 ; H01L23/31 ; H01L23/00
Abstract:
A method includes the operations performing a first anisotropic etching process to remove a portion of the metal sheet from a top surface of the metal sheet, thereby forming a plurality of first recesses in the metal sheet; mounting a carrier on the top surface of the metal sheet, covering the first recesses; performing a second anisotropic etching process to remove a portion of the metal sheet under the first recesses from the bottom surface of the metal sheet; filling a molding material from the bottom surface of the metal sheet, leaving the bottom surface of the metal sheet exposed; forming a passivation layer on the top surface of the metal sheet, having a plurality of openings therethrough; forming a plurality of first metal vias through the opening; and forming a solder mask layer on the passivation layer, leaving the first metal vias exposed.
Public/Granted literature
- US20140127865A1 MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2014-05-08
Information query
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