There is provided a semiconductor device including: plural bit cells each including the same circuit; plural electrodes supplied with power from outside, wherein each of the respective plural electrodes is mounted above the same circuit within the plural bit cells. Further, there is provided a semiconductor package including: the semiconductor device; a substrate mounted with the semiconductor device; an external input terminal formed on the substrate; an external output terminal formed on the substrate; an input wiring pattern connecting the semiconductor device mounted above the substrate and the external input terminal; an output wiring pattern connecting the semiconductor device mounted above the substrate and the external output terminal; and plural power supply lines, arranged without contact with each other on the same face of the substrate, and connecting the plural electrodes mounted to the semiconductor device to the corresponding electrode from the plural external power input electrodes.