Invention Grant
US08860496B2 Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices
有权
通过使用电源电压或接地连接接收和传输电压的方法，包括用于集成电路器件的接合焊盘互连
- Patent Title: Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices
- Patent Title (中): 通过使用电源电压或接地连接接收和传输电压的方法，包括用于集成电路器件的接合焊盘互连
-
Application No.: US14021268Application Date: 2013-09-09
-
Publication No.: US08860496B2Publication Date: 2014-10-14
- Inventor: Mostafa Naguib Abdulla , Steven Eskildsen
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Knobbe Martens Olson and Bear, LLP
- Main IPC: G11C5/14
- IPC: G11C5/14 ; H01L23/50 ; H01L27/02 ; H01L23/00 ; H01L23/498
Abstract:
Embodiments disclosed herein may relate to supply voltage or ground connections for integrated circuit devices. As one example, two or more supply voltage bond pads on an integrated circuit die may be connected together via one or more electrically conductive interconnects.
Public/Granted literature
- US20140009218A1 SUPPLY VOLTAGE OR GROUND CONNECTIONS INCLUDING BOND PAD INTERCONNECTS FOR INTEGRATED CIRCUIT DEVICE Public/Granted day:2014-01-09
Information query
