发明授权
- 专利标题: Integrated circuit having ESD protection capability
- 专利标题(中): 具有ESD保护能力的集成电路
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申请号: US13401865申请日: 2012-02-22
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公开(公告)号: US08861160B2公开(公告)日: 2014-10-14
- 发明人: Chien-Ming Wu , Kai-Yin Liu
- 申请人: Chien-Ming Wu , Kai-Yin Liu
- 申请人地址: TW Science Park, HsinChu
- 专利权人: Realtek Semiconductor Corp.
- 当前专利权人: Realtek Semiconductor Corp.
- 当前专利权人地址: TW Science Park, HsinChu
- 代理商 Winston Hsu; Scott Margo
- 优先权: TW100108064A 20110310
- 主分类号: H02H3/20
- IPC分类号: H02H3/20 ; H03K17/082 ; H03K19/003 ; H02H9/04
摘要:
The present invention provides an integrated circuit having a better ESD protection capability and capable of reducing a circuit layout area. The integrated circuit comprises: an internal circuit, a first pad, and at least a first impedance matching unit. The first impedance matching unit is coupled between the internal circuit and the first pad, and the first impedance matching unit comprises: a first switch unit and a first resistance unit. The first switch unit is coupled to the internal circuit, and the first resistance unit is coupled between the first switch unit and the first pad, wherein the first resistance unit has a first terminal and a second terminal. The first terminal is directly electrically connected to the first pad and the second terminal is coupled to the first switch unit.
公开/授权文献
- US20120229940A1 INTEGRATED CIRCUIT HAVING ESD PROTECTION CAPABILITY 公开/授权日:2012-09-13
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