发明授权
- 专利标题: Multilayer ceramic electronic component having an average surface roughness to provide adhesion strength between a dielectric layer and inner electrode and fabrication method thereof
- 专利标题(中): 具有平均表面粗糙度以提供介电层和内部电极之间的粘附强度的多层陶瓷电子部件及其制造方法
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申请号: US13333359申请日: 2011-12-21
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公开(公告)号: US08867190B2公开(公告)日: 2014-10-21
- 发明人: Jong Han Kim , Hyun Chul Jeong , Jae Man Park
- 申请人: Jong Han Kim , Hyun Chul Jeong , Jae Man Park
- 申请人地址: KR Suwon, Gyunggi-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon, Gyunggi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2011-0091229 20110908
- 主分类号: H01G4/06
- IPC分类号: H01G4/06 ; H01G4/005 ; H01G4/30
摘要:
There is provided a multilayer ceramic electronic component, including: a ceramic main body including a dielectric layer; and inner electrodes disposed to face each other within the ceramic main body, with the dielectric layer interposed therebetween, wherein, when an average thickness of the dielectric layer is td and an average thickness of the inner electrodes is te, 0.1 μm≦te≦0.5 μm and (td+te)/te≦2.5 are satisfied, and when an average surface roughness on a virtual surface roughness center line of the inner electrode is Ra and an average roughness of ten points of the inner electrode is Rz, 5 nm≦Ra≦30 nm, 150 nm≦Rz≦td/2, and 8≦Rz/Ra≦20 are satisfied. The multilayer ceramic electronic component has excellent reliability by improving adhesion strength between the dielectric layer and the inner electrodes and withstand voltage characteristics.
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