Invention Grant
- Patent Title: Socket and device having the socket
- Patent Title (中): 插座和具有插座的设备
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Application No.: US13230089Application Date: 2011-09-12
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Publication No.: US08870592B2Publication Date: 2014-10-28
- Inventor: Yasushi Masuda , Akira Tamura , Satoshi Osawa
- Applicant: Yasushi Masuda , Akira Tamura , Satoshi Osawa
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Squire Patton Boggs (US) LLP
- Priority: JP2010-260918 20101124
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K7/10 ; H01R12/70 ; H01R12/91
Abstract:
A socket for providing an electric connection between a package and an electronic circuit board, the socket includes a package mounting area in which the package is mounted and an isotropic elastic body provided on the package mounting area and having a continuous shape along four side walls of the package so as to press the four side walls of the package.
Public/Granted literature
- US20120129361A1 SOCKET AND DEVICE HAVING THE SOCKET Public/Granted day:2012-05-24
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