Invention Grant
- Patent Title: Circuit interconnect device racking apparatus, racking assemblies, and methods of connecting circuit interconnect devices
- Patent Title (中): 电路互连设备支架设备,机架组件以及连接电路互连设备的方法
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Application No.: US13595653Application Date: 2012-08-27
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Publication No.: US08873223B2Publication Date: 2014-10-28
- Inventor: Megan Rahn , Brian Campbell , Russell J. Wedemeyer , Thomas W. Hawkins
- Applicant: Megan Rahn , Brian Campbell , Russell J. Wedemeyer , Thomas W. Hawkins
- Applicant Address: US GA Alpharetta
- Assignee: Siemens Industry, Inc.
- Current Assignee: Siemens Industry, Inc.
- Current Assignee Address: US GA Alpharetta
- Main IPC: H02B1/04
- IPC: H02B1/04 ; H02B1/20 ; H02B1/056 ; H01H71/02 ; H01H71/08

Abstract:
A circuit interconnect device racking apparatus is disclosed. The circuit interconnect device racking apparatus has a body adapted to couple to a circuit interconnect device, one or more frame connectors coupled to the body, a racking lever coupled to the body by a lever pivot, the racking lever having a cam mechanism component, and one or more bus connectors configured to connect to or disconnect from one or more bus bars responsive to rotation of the racking lever. Circuit interconnect device racking assemblies having the circuit interconnect device racking apparatus and methods of connecting circuit interconnect devices to one or more bus bars are disclosed, as are other aspects.
Public/Granted literature
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