发明授权
- 专利标题： Flexible circuit electrode array for improved layer adhesion
- 专利标题（中）： 柔性电路电极阵列，可改善层间粘附力
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申请号： US13466692申请日： 2012-05-08
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公开(公告)号： US08874224B2公开(公告)日： 2014-10-28
- 发明人: Robert Jay Greenberg , Mark S. Humayun
- 申请人： Robert Jay Greenberg , Mark S. Humayun
- 申请人地址： US CA Sylmar
- 专利权人： Second Sight Medical Products, Inc.
- 当前专利权人： Second Sight Medical Products, Inc.
- 当前专利权人地址： US CA Sylmar
- 代理商 Scott B. Dunbar; Alessandro Steinfl
- 主分类号： A61N1/05
- IPC分类号： A61N1/05 ; A61N1/36
摘要：
The present invention is a flexible circuit electrode array for improved layer adhesions where the metal conductors overlap the polymer insulator. The steps to build the flexible circuit are as follows. Deposit a base polymer layer. Deposit a conductive trace over the base polymer layer. Deposit a top polymer layer over the trace and prepare a void in the top polymer layer smaller than the surface of the trace. Deposit an electrode on the trace through the void with a periphery larger than, and overlapping the void.
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