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US08876998B2 Method for manufacturing flexible flat device 有权
柔性扁平装置的制造方法

Method for manufacturing flexible flat device
Abstract:
Disclosed is a method for manufacturing a flexible device comprising: forming an adhesive layer on a support substrate; adhering a flexible substrate onto the adhesive layer; forming a device layer on the flexible substrate; and separating the support substrate from the flexible substrate, wherein the adhesive layer comprises a self-assembled monolayer (SAM).
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