Invention Grant
US08877570B2 Array substrate with improved pad region and method for manufacturing the same
有权
具有改进的焊盘区域的阵列衬底及其制造方法
- Patent Title: Array substrate with improved pad region and method for manufacturing the same
- Patent Title (中): 具有改进的焊盘区域的阵列衬底及其制造方法
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Application No.: US13691143Application Date: 2012-11-30
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Publication No.: US08877570B2Publication Date: 2014-11-04
- Inventor: JongWoo Kim , ChangHo Oh , WonHyung Yoo , SangYoon Paik , JunKi Kang , JongHoon Kim
- Applicant: LG Display Co., Ltd.
- Applicant Address: KR Seoul
- Assignee: LG Display Co., Ltd.
- Current Assignee: LG Display Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: Fenwick & West LLP
- Priority: KR10-2011-0128547 20111202
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/84 ; H01L27/12 ; H01L33/16 ; H01L33/00 ; G02F1/1345
Abstract:
An array substrate having a wiring of a pad region formed without an insulating film or without an insulating film and an organic film to reduce abnormal operations due to an increase in resistance caused by a contact margin at a high temperature, and a method for manufacturing the same are provided. The array substrate includes: an insulating substrate including a pad region and a thin film transistor (TFT) formation region; a first electrode layer formed in the pad region of the substrate; and a second electrode formed on the first electrode layer in an overlapping manner.
Public/Granted literature
- US20130140572A1 ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2013-06-06
Information query
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