发明授权
- 专利标题： Epoxy resin composition with sulfonium borate complex
- 专利标题（中）： 环氧树脂组合物与硼酸锍络合物
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申请号： US13123369申请日： 2009-12-02
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公开(公告)号： US08877878B2公开(公告)日： 2014-11-04
- 发明人: Yoshihisa Shinya , Jun Yamamoto , Ryota Aizaki , Naoki Hayashi , Misao Konishi , Yasuhiro Fujita
- 申请人： Yoshihisa Shinya , Jun Yamamoto , Ryota Aizaki , Naoki Hayashi , Misao Konishi , Yasuhiro Fujita
- 申请人地址： JP Tokyo
- 专利权人： Dexerials Corporation
- 当前专利权人： Dexerials Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Oliff PLC
- 优先权： JP2008-310827 20081205
- 国际申请： PCT/JP2009/070222 WO 20091202
- 国际公布： WO2010/064648 WO 20100610
- 主分类号： B01J31/14
- IPC分类号： B01J31/14 ; C08G59/72 ; C08L63/00 ; C08L63/02 ; C08L63/04 ; H01L23/00 ; H05K1/02 ; C07F5/02 ; C08G59/68 ; C07C381/12
摘要：
A sulfonium borate complex that is capable of reducing the amount of fluorine ions generated during thermal cationic polymerization, and is capable of providing a thermal cationic polymerizable adhesive with low-temperature fast curing properties is represented by a structure represented by the formula (1). In the formula (1), R1 is an aralkyl group, R2 is a lower alkyl group, and R3 is a lower alkoxycarbonyl group. X is a halogen atom, and n is an integer of from 1 to 3.
公开/授权文献
- US20110192639A1 NOVEL SULFONIUM BORATE COMPLEX 公开/授权日：2011-08-11
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