Invention Grant
US08878314B2 MEMS package or sensor package with intra-cap electrical via and method thereof
有权
MEMS封装或带帽内电通孔的传感器封装及其方法
- Patent Title: MEMS package or sensor package with intra-cap electrical via and method thereof
- Patent Title (中): MEMS封装或带帽内电通孔的传感器封装及其方法
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Application No.: US13425543Application Date: 2012-03-21
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Publication No.: US08878314B2Publication Date: 2014-11-04
- Inventor: Andrew B. Graham , Gary Yama , Gary O'Brien
- Applicant: Andrew B. Graham , Gary Yama , Gary O'Brien
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Michael Best & Friedrich LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00
Abstract:
A MEMS device structure including a lateral electrical via encased in a cap layer and a method for manufacturing the same. The MEMS device structure includes a cap layer positioned on a MEMS device layer. The cap layer covers a MEMS device and one or more MEMS device layer electrodes in the MEMS device layer. The cap layer includes at least one cap layer electrode accessible from the surface of the cap layer. An electrical via is encased in the cap layer extending across a lateral distance from the cap layer electrode to the one or more MEMS device layer electrodes. An isolating layer is positioned around the electrical via to electrically isolate the electrical via from the cap layer.
Public/Granted literature
- US20120261774A1 MEMS PACKAGE OR SENSOR PACKAGE WITH INTRA-CAP ELECTRICAL VIA AND METHOD THEREOF Public/Granted day:2012-10-18
Information query
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