A method, computer-readable medium, and semiconductor device for securing integrated engineering analysis are provided. A die ID is generated from a lot ID, wafer ID, die coordinates, or other product information. The die ID is encrypted with a key and written to the die. The encryption key and encrypted die ID may be stored in a secure storage. A die is fabricated with an encryption module and an unencrypted die ID. The encryption module is provided with an unencrypted die ID, encrypts the unencrypted die ID, and writes the encrypted die ID to a die fuse.