发明授权
- 专利标题： Method for chip packaging
- 专利标题（中）： 芯片封装方法
-
申请号： US13883231申请日： 2011-10-18
-
公开(公告)号： US08883627B2公开(公告)日： 2014-11-11
- 发明人: Lei Shi , Guohua Gao , Yujuan Tao , Naomi Masuda , Koichi Meguro
- 申请人： Lei Shi , Guohua Gao , Yujuan Tao , Naomi Masuda , Koichi Meguro
- 申请人地址： CN Nantong, Jiangsu
- 专利权人： Nantong Fujitsu Microelectronics Co., Ltd.
- 当前专利权人： Nantong Fujitsu Microelectronics Co., Ltd.
- 当前专利权人地址： CN Nantong, Jiangsu
- 代理机构： Faegre Baker Daniels LLP
- 优先权： CN201010534388 20101105
- 国际申请： PCT/CN2011/080874 WO 20111018
- 国际公布： WO2012/059003 WO 20120510
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/768 ; H01L21/78 ; H01L23/31 ; H01L21/56 ; H01L23/00
摘要：
Provided is a method for chip packaging, including the steps of: providing a semi-packaged wafer which has a cutting trail and a metal bonding pad of the chip; forming a first protective layer on the cutting trail; forming on the metal bonding pad a sub-ball metal electrode; forming a solder ball on the sub-ball metal electrode; dicing the wafer along the cutting trail. The first protective layer according to the present invention can prevent the metal in the cutting trail from being separated by electroplating, and protect the lateral sides of a discrete chip after cutting. The process flow thereof is simple, and enhances the efficiency of the packaging as well as its yield.
公开/授权文献
- US20130280904A1 METHOD FOR CHIP PACKAGING 公开/授权日：2013-10-24
信息查询
IPC分类:
