发明授权
- 专利标题: Vertical power MOSFET and methods of forming the same
- 专利标题(中): 垂直功率MOSFET及其形成方法
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申请号: US13486633申请日: 2012-06-01
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公开(公告)号: US08884369B2公开(公告)日: 2014-11-11
- 发明人: Chun-Wai Ng , Hsueh-Liang Chou , Ruey-Hsin Liu , Po-Chih Su
- 申请人: Chun-Wai Ng , Hsueh-Liang Chou , Ruey-Hsin Liu , Po-Chih Su
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L29/66
- IPC分类号: H01L29/66
摘要:
A device includes a semiconductor layer of a first conductivity type, and a first and a second body region over the semiconductor layer, wherein the first and the second body regions are of a second conductivity type opposite the first conductivity type. A doped semiconductor region of the first conductivity type is disposed between and contacting the first and the second body regions. A gate dielectric layer is disposed over the first and the second body regions and the doped semiconductor region. A first and a second gate electrode are disposed over the gate dielectric layer, and overlapping the first and the second body regions, respectively. The first and the second gate electrodes are physically separated from each other by a space, and are electrically interconnected. The space between the first and the second gate electrodes overlaps the doped semiconductor region.
公开/授权文献
- US20130320430A1 Vertical Power MOSFET and Methods of Forming the Same 公开/授权日:2013-12-05
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