Invention Grant
- Patent Title: Load measuring apparatus
- Patent Title (中): 负载测量仪
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Application No.: US13144862Application Date: 2009-11-19
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Publication No.: US08887584B2Publication Date: 2014-11-18
- Inventor: Hironori Tohmyoh , Md. Abdus Salam Akanda
- Applicant: Hironori Tohmyoh , Md. Abdus Salam Akanda
- Applicant Address: JP Sendai
- Assignee: Tohoku University
- Current Assignee: Tohoku University
- Current Assignee Address: JP Sendai
- Agency: Oliff PLC
- Priority: JP2009-010322 20090120
- International Application: PCT/JP2009/069612 WO 20091119
- International Announcement: WO2010/084662 WO 20100729
- Main IPC: G01L1/04
- IPC: G01L1/04 ; G01L1/14 ; G01Q20/02 ; B82Y35/00

Abstract:
A high-accuracy load measuring apparatus capable of enlarging a measurement range includes a loading section provided at one end of a long and narrow beam. A support supports the beam at a side closer to the other end of the beam than the loading section. A displacement sensor includes a capacitive sensor and is provided to measure a displacement of the loading section. The beam includes a pair of long and narrow plate-like legs arranged in parallel while being spaced apart in a thickness direction and a connecting portion connecting ends of the plate-like legs at a side of the loading section. The beam is supported on the support to have a changeable length between a supported position by the support and the loading section. Each plate-like leg includes a slot, which is a long and narrow hole formed along a length direction in a widthwise central part.
Public/Granted literature
- US20110296929A1 LOAD MEASURING APPARATUS Public/Granted day:2011-12-08
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