- 专利标题: High density three-dimensional electrical interconnections
- 专利标题(中): 高密度三维电互连
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申请号: US13614879申请日: 2012-09-13
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公开(公告)号: US08888254B2公开(公告)日: 2014-11-18
- 发明人: Xuejin Wen , Peter J. Nystrom , Gary D. Redding , Jun Ma
- 申请人: Xuejin Wen , Peter J. Nystrom , Gary D. Redding , Jun Ma
- 申请人地址: US CT Norwalk
- 专利权人: Xerox Corporation
- 当前专利权人: Xerox Corporation
- 当前专利权人地址: US CT Norwalk
- 代理机构: MH2 Technology Law Group LLP
- 主分类号: B41J2/045
- IPC分类号: B41J2/045
摘要:
Implementations relate to methods, devices produced by the method, and systems using the devices, for forming three-dimensional interconnect structures for ink piezoelectric printheads. A piezoelectric element array for an ink jet print head can include a plurality of piezoelectric elements spaced from adjacent piezoelectric elements by an interstitial space. Each piezoelectric element can include a central void space formed in a first intermediate layer between the piezoelectric element array and a second intermediate layer that is operable to function as a free space for portions of the piezoelectric elements to actuate into when subjected to the voltage.
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