发明授权

High density three-dimensional electrical interconnections
摘要:
Implementations relate to methods, devices produced by the method, and systems using the devices, for forming three-dimensional interconnect structures for ink piezoelectric printheads. A piezoelectric element array for an ink jet print head can include a plurality of piezoelectric elements spaced from adjacent piezoelectric elements by an interstitial space. Each piezoelectric element can include a central void space formed in a first intermediate layer between the piezoelectric element array and a second intermediate layer that is operable to function as a free space for portions of the piezoelectric elements to actuate into when subjected to the voltage.
信息查询
0/0