Invention Grant
US08889053B2 Mold apparatus, injection molding apparatus, and injection molding method
有权
模具设备,注射成型设备和注射成型方法
- Patent Title: Mold apparatus, injection molding apparatus, and injection molding method
- Patent Title (中): 模具设备,注射成型设备和注射成型方法
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Application No.: US13754815Application Date: 2013-01-30
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Publication No.: US08889053B2Publication Date: 2014-11-18
- Inventor: Atsushi Nakahara
- Applicant: Nissei ASB Machine Co., Ltd.
- Applicant Address: JP Nagano
- Assignee: Nissei ASB Machine Co., Ltd.
- Current Assignee: Nissei ASB Machine Co., Ltd.
- Current Assignee Address: JP Nagano
- Agency: Hoffman Patent Group
- Agent David L. Hoffman
- Priority: JP2012-019261 20120131
- Main IPC: B29C45/36
- IPC: B29C45/36 ; B29D22/00 ; B29C45/80 ; B29C45/26 ; B29C45/56 ; B29K105/00

Abstract:
A mold apparatus, an injection molding apparatus, and an injection molding method, which can satisfactorily form a preform having a bottom thicker than a body, are provided. The mold apparatus comprises a neck mold, an injection cavity mold, and an injection core mold having an inside core mold and an outside core mold, and further comprises a regulation means, such as an urging member, for regulating the movement of the inside core mold toward the outside of the injection cavity mold.
Public/Granted literature
- US20130196020A1 MOLD APPARATUS, INJECTION MOLDING APPARATUS, AND INJECTION MOLDING METHOD Public/Granted day:2013-08-01
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