Invention Grant
- Patent Title: Method of fabricating single-layer graphene
- Patent Title (中): 制造单层石墨烯的方法
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Application No.: US13937563Application Date: 2013-07-09
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Publication No.: US08890171B2Publication Date: 2014-11-18
- Inventor: Yun-sung Woo , Seon-mi Yoon , Hyeon-jin Shin , Dong-wook Lee , Jae-young Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2012-0076281 20120712
- Main IPC: H01L29/15
- IPC: H01L29/15 ; H01L21/02 ; H01L29/16

Abstract:
A method of fabricating a single-layer graphene on a silicon carbide (SiC) wafer includes forming a plurality of graphene layers on the SiC wafer such that the plurality of graphene layers are on a buffer layer of the SiC wafer, the buffer layer being formed of carbon; removing the plurality of graphene layers from the buffer layer; and converting the buffer layer to a single-layer graphene.
Public/Granted literature
- US20140014970A1 METHOD OF FABRICATING SINGLE-LAYER GRAPHENE Public/Granted day:2014-01-16
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