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US08890274B2 Interconnect structure for CIS flip-chip bonding and methods for forming the same 有权
用于CIS倒装芯片接合的互连结构及其形成方法

Interconnect structure for CIS flip-chip bonding and methods for forming the same
摘要：
A device includes a metal pad at a surface of an image sensor chip, wherein the image sensor chip includes an image sensor. A stud bump is disposed over, and electrically connected to, the metal pad. The stud bump includes a bump region, and a tail region connected to the bump region. The tail region includes a metal wire portion substantially perpendicular to a top surface of the metal pad. The tail region is short enough to support itself against gravity.
摘要（中）：

一种设备包括在图像传感器芯片的表面处的金属焊盘，其中图像传感器芯片包括图像传感器。 螺柱凸块设置在金属垫的上方并电连接到金属垫。 凸起凸块包括凸起区域和连接到凸起区域的尾部区域。 尾部区域包括基本上垂直于金属垫的顶表面的金属线部分。 尾部区域足够短，能够抵抗重力。

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