Invention Grant
- Patent Title: Systems and methods for fabricating semiconductor device structures using different metrology tools
- Patent Title (中): 使用不同计量工具制造半导体器件结构的系统和方法
-
Application No.: US13841919Application Date: 2013-03-15
-
Publication No.: US08892237B2Publication Date: 2014-11-18
- Inventor: Alok Vaid , Carsten Hartig
- Applicant: GLOBALFOUNDRIES, Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, Inc.
- Current Assignee: GLOBALFOUNDRIES, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: G06F19/00
- IPC: G06F19/00 ; H01L21/66 ; G01D21/00 ; H01L21/67 ; H01L21/02
Abstract:
Methods and systems are provided for fabricating and measuring physical features of a semiconductor device structure. An exemplary method of fabricating a semiconductor device structure involves obtaining a first measurement of a first attribute of the semiconductor device structure from a first metrology tool, obtaining process information pertaining to fabrication of one or more features of the semiconductor device structure by a first processing tool, and determining an adjusted measurement for the first attribute based at least in part on the first measurement in a manner that is influenced by the process information.
Public/Granted literature
- US20140273299A1 SYSTEMS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE STRUCTURES USING DIFFERENT METROLOGY TOOLS Public/Granted day:2014-09-18
Information query
