发明授权
- 专利标题: Contact with anti-rotation elements and solder flow abatement
- 专利标题(中): 接触抗旋转元件和消除焊料流动
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申请号: US13780339申请日: 2013-02-28
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公开(公告)号: US08894423B2公开(公告)日: 2014-11-25
- 发明人: John Mongold , Randall Musser , Brian Vicich , Neal Patterson
- 申请人: Samtec, Inc.
- 申请人地址: US IN New Albany
- 专利权人: Samtec, Inc.
- 当前专利权人: Samtec, Inc.
- 当前专利权人地址: US IN New Albany
- 代理机构: Keating & Bennett, LLP
- 主分类号: H01R12/00
- IPC分类号: H01R12/00 ; H01R13/02 ; H01R13/428 ; H01R13/41 ; H01R12/57 ; H01R13/11 ; H01R12/71
摘要:
A contact includes a head, a tail including an opening, a body connected at one end thereof to the head and at another end thereof to the tail, a first lance and a second lance extending from the body, a dimple raised from the body, and a solder member attached to the tail such that the solder member engages at least a portion of the opening. The first lance and the second lance are arranged to deflect when the contact is inserted into a connector; and the first lance, the second lance, and the dimple are arranged to frictionally secure the contact to the connector.
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