A contact module includes a conductive holder and a frame assembly received in the conductive holder with receptacle signal contacts arranged in differential pairs. A ground shield is received in the conductive holder between the frame assembly and the conductive holder. The ground shield has a mounting end with ground pins extending from a mounting edge at the mounting end of the ground shield. Forces are imparted on the ground pins during coupling with a circuit board. The mounting end has a plurality of bearing surfaces proximate to the ground pins. The bearing surfaces engage at least one of the conductive holder and the frame assembly to transfer the forces between the ground shield and at least one of the conductive holder and the frame assembly.