Invention Grant
- Patent Title: Method of making a floor panel
- Patent Title (中): 制作地板的方法
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Application No.: US12859357Application Date: 2010-08-19
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Publication No.: US08894794B2Publication Date: 2014-11-25
- Inventor: Richard H. Balmer , Shih Chung Lee , Dung V. Dao , John R. Eshbach, Jr. , Heath E. Harrington , Michael E. Buckwalter , Kean M. Anspach
- Applicant: Richard H. Balmer , Shih Chung Lee , Dung V. Dao , John R. Eshbach, Jr. , Heath E. Harrington , Michael E. Buckwalter , Kean M. Anspach
- Applicant Address: US DE Wilmington
- Assignee: AWI Licensing Company
- Current Assignee: AWI Licensing Company
- Current Assignee Address: US DE Wilmington
- Agent Amy M. Fernandez
- Main IPC: B29C65/48
- IPC: B29C65/48 ; B32B38/04 ; B32B38/10 ; E04F15/10 ; B32B37/12 ; B32B37/26

Abstract:
A method of making a floor panel includes the steps of: providing an adhesive on a release member; laminating or marrying the release member to a bottom layer such that the adhesive is between the release member and the bottom layer; removing a portion of the release member to expose an area of the adhesive; and adhering a top layer to the area such that the top layer is offset with respect to the bottom layer in a direction of length and width and a marginal end portion of a top surface of the bottom layer and a marginal end portion of the bottom surface of the top layer is exposed.
Public/Granted literature
- US20110042003A1 Method of making a floor panel Public/Granted day:2011-02-24
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