Invention Grant
- Patent Title: Glass composition, electrically conductive paste composition comprising same, electrode wiring member, and electronic component
- Patent Title (中): 玻璃组合物，包含其的导电糊组合物，电极配线构件和电子部件
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Application No.: US13259327Application Date: 2010-03-26
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Publication No.: US08895460B2Publication Date: 2014-11-25
- Inventor: Shinichi Tachizono , Kei Yoshimura , Yuji Hashiba , Takashi Naito , Takuya Aoyagi
- Applicant: Shinichi Tachizono , Kei Yoshimura , Yuji Hashiba , Takashi Naito , Takuya Aoyagi
- Applicant Address: JP Chiba
- Assignee: Hitachi Powdered Metals Co., Ltd.
- Current Assignee: Hitachi Powdered Metals Co., Ltd.
- Current Assignee Address: JP Chiba
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2009-078961 20090327
- International Application: PCT/JP2010/002188 WO 20100326
- International Announcement: WO2010/109905 WO 20100930
- Main IPC: C03C3/21
- IPC: C03C3/21 ; C03C8/18 ; H01L31/0224 ; C03C8/08
Abstract:
A glass composition according to the present invention comprises: phosphorus, vanadium and at least one transition metal selected from a group consisting of tungsten, iron, and manganese, the glass composition not containing substances included in the JIG level A and B lists, a softening point of the glass composition being 550° C. or lower.
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