Invention Grant
US08895871B2 Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller
有权
具有多个电路板层的电路板，所述多个电路板层具有裸露的裸片安装用于变速箱控制器
- Patent Title: Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller
- Patent Title (中): 具有多个电路板层的电路板，所述多个电路板层具有裸露的裸片安装用于变速箱控制器
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Application No.: US13515907Application Date: 2010-10-15
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Publication No.: US08895871B2Publication Date: 2014-11-25
- Inventor: Juergen Sauerbier , Wolfgang Gruebl , Bernhard Schuch , Hubert Trageser , Hermann-Josef Robin
- Applicant: Juergen Sauerbier , Wolfgang Gruebl , Bernhard Schuch , Hubert Trageser , Hermann-Josef Robin
- Applicant Address: DE Nuremberg
- Assignee: Conti Temic microelectronic GmbH
- Current Assignee: Conti Temic microelectronic GmbH
- Current Assignee Address: DE Nuremberg
- Agent W. F. Fasse
- Priority: DE102009058914 20091217; DE102009058915 20091217
- International Application: PCT/DE2010/001209 WO 20101015
- International Announcement: WO2011/072629 WO 20110623
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/02 ; H05K1/03
Abstract:
A circuit board has a plurality of circuit board layers that are arranged one over the other, and that each include an electrically insulating base material having a glass transition temperature greater than or equal to 170° C. The circuit board layers each further have at least one thermally conductive layer applied to the base material. Several vias extend through respective ones of the circuit board layers to connect thermally conductive layers of different circuit board layers, such that the vias and the thermally conductive layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer.
Public/Granted literature
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