Invention Grant
- Patent Title: Electrical connector with solder ball positioned in an insulative housing accurately
- Patent Title (中): 具有焊球的电连接器准确地定位在绝缘外壳中
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Application No.: US13589190Application Date: 2012-08-20
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Publication No.: US08899997B2Publication Date: 2014-12-02
- Inventor: Jie-Feng Zhang , Yang Zhou , Fu-Jin Peng
- Applicant: Jie-Feng Zhang , Yang Zhou , Fu-Jin Peng
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: CN201120304208 20110819
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H01R12/57

Abstract:
An electrical connector includes an insulative housing having a top surface, a bottom surface opposite to the top surface and a number of receiving holes penetrated the top surface and the bottom surface, a number of terminals receiving in the receiving holes and a number of solder balls assembled to the receiving holes from a bottom surface thereof and contacting with the corresponding terminals. The receiving hole includes an inner wall and a core, the inner wall has a pair of ribs extending toward to the core and the movement of the solder ball in a vertical direction is limited by the pair of ribs in a vertical direction and the solder ball is positioned by the terminal.
Public/Granted literature
- US20130045639A1 ELECTRICAL CONNECTOR WITH SOLDER BALL POSITIONED IN AN INSULATIVE HOUSING ACCURATELY Public/Granted day:2013-02-21
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