A high bulk laminated board is produced using one or more embossed plies. A method of producing the laminated board comprises: embossing first and second plies to produce first embossed projections extending from first sides of the first and second plies; placing adhesive on the first embossed projections on the first side of each of the first and second embossed plies; bringing the first and second plies together such that the first embossed projections on the first and second embossed plies are aligned; applying pressure to the first side of each of the first and second embossed plies to cause the first and second embossed plies to adhere together to form a composite ply; and adhering first and second flat outer plies onto first and second sides of the composite ply. Corresponding apparatus is provided.