Invention Grant
- Patent Title: Chambers with improved cooling devices
- Patent Title (中): 改善冷却装置的房间
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Application No.: US13787960Application Date: 2013-03-07
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Publication No.: US08901518B2Publication Date: 2014-12-02
- Inventor: Joseph M. Ranish , Aaron Muir Hunter
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: G21K5/04
- IPC: G21K5/04 ; F25B29/00

Abstract:
Embodiments of the present invention provide a heating assembly using a heat exchange device to cool a plurality of heating element. The heating assembly includes a plurality of heating elements, a cooling element having one or more cooling channels for receiving cooling fluid therein, and a heat exchange device disposed between the plurality of heating elements and the cooling element. The heat exchange device comprises a hot interface disposed adjacent to and in thermal contact with the plurality of heating elements and a cold interface disposed adjacent to and in thermal contact with the cooling element.
Public/Granted literature
- US20140027092A1 CHAMBERS WITH IMPROVED COOLING DEVICES Public/Granted day:2014-01-30
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