Invention Grant
US08906744B2 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
有权
具有金属引线的微电子管芯封装，包括用于堆叠管芯封装的金属引线，以及相关的系统和方法
- Patent Title: Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
- Patent Title (中): 具有金属引线的微电子管芯封装，包括用于堆叠管芯封装的金属引线，以及相关的系统和方法
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Application No.: US14029455Application Date: 2013-09-17
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Publication No.: US08906744B2Publication Date: 2014-12-09
- Inventor: Meow Koon Eng , Yong Poo Chia , Suan Jeung Boon
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Priority: SG200705422 20070724
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/10 ; H01L21/50 ; H01L23/495 ; H01L23/00 ; H01L23/31
Abstract:
Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.
Public/Granted literature
Information query
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