Invention Grant
- Patent Title: Multichip electronic packages and methods of manufacture
- Patent Title (中): Multichip电子封装和制造方法
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Application No.: US13491174Application Date: 2012-06-07
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Publication No.: US08906809B2Publication Date: 2014-12-09
- Inventor: Martin M. Beaumier , Steven P. Ostrander , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
- Applicant: Martin M. Beaumier , Steven P. Ostrander , Kamal K. Sikka , Hilton T. Toy , Jeffrey A. Zitz
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran & Cole, P.C.
- Agent Steven Meyers
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461 ; H01L23/42 ; H01L23/10 ; H01L23/433
Abstract:
A multi-chip electronic package and methods of manufacture are provided. The structure includes a lid encapsulating at least one chip mounted on a chip carrier; at least one seal shim fixed between the lid and the chip carrier, the at least one seal shim forming a gap between pistons of the lid and respective ones of the chips; and thermal interface material within the gap and contacting the pistons of the lid and respective ones of the chips.
Public/Granted literature
- US20120241944A1 MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE Public/Granted day:2012-09-27
Information query
IPC分类:
