Invention Grant
- Patent Title: Pressure-sensitive adhesive layer and pressure-sensitive adhesive sheet
- Patent Title (中): 压敏粘合剂层和压敏粘合片
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Application No.: US14227700Application Date: 2014-03-27
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Publication No.: US08906989B2Publication Date: 2014-12-09
- Inventor: Natsuko Watanabe , Kazuma Mitsui , Tatsumi Amano , Kenjiro Niimi
- Applicant: Nitto Denko Corporation
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2013-073361 20130329; JP2013-249793 20131203
- Main IPC: C09J11/06
- IPC: C09J11/06

Abstract:
A pressure-sensitive adhesive layer contains a base polymer and has properties of (1) and (2) below: in a case where a pressure-sensitive adhesive sheet A is laminated to an adherend X surface, they are left to stand at a temperature of 23° C. and a humidity of 30% for 12 hours, and the pressure-sensitive adhesive sheet A is then separated, (1) a water contact angle A on the adherend X surface from which the pressure-sensitive adhesive sheet A has been separated is 70° or less, and (2) a pressure-sensitive adhesive strength of a pressure-sensitive adhesive tape B with respect to the adherend X surface from which the pressure-sensitive adhesive sheet A has been separated is higher than that of the pressure-sensitive adhesive tape B with respect to the adherend X surface not subjected to any treatment.
Public/Granted literature
- US20140296401A1 PRESSURE-SENSITIVE ADHESIVE LAYER AND PRESSURE-SENSITIVE ADHESIVE SHEET Public/Granted day:2014-10-02
Information query
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