发明授权
US08912584B2 PFET polysilicon layer with N-type end cap for electrical shunt 有权
PFET多晶硅层,带N型端盖,用于电气分流

PFET polysilicon layer with N-type end cap for electrical shunt
摘要:
A semiconductor device includes a PFET transistor (a PMOS FET) having a poly(silicon) layer with a p-type doped portion and an n-type doped portion. The p-type doped portion is located above a channel region of the transistor and the n-type doped portion is located in an end portion of the poly layer outside the channel region. The poly layer may be formed by doping portions of an amorphous silicon layer with either the p-type dopant or the n-type dopant and then annealing the amorphous silicon layer to diffuse the dopants and crystallize the amorphous silicon to form polysilicon. The n-type doped portion of the poly layer may provide an electrical shunt in the end portion of the poly layer to reduce any effects of insufficient diffusion of the p-type dopant in the poly layer.
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