发明授权
- 专利标题： High frequency transition matching in an electronic package for millimeter wave semiconductor dies
- 专利标题（中）： 用于毫米波半导体管芯的电子封装中的高频转换匹配
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申请号： US13433313申请日： 2012-03-29
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公开(公告)号： US08912634B2公开(公告)日： 2014-12-16
- 发明人: Elad Danny , Kaminski Noam , Okamoto Keishi , Shumaker Evgeny , Toriyama Kazushige
- 申请人： Elad Danny , Kaminski Noam , Okamoto Keishi , Shumaker Evgeny , Toriyama Kazushige
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/58
- IPC分类号： H01L23/58 ; H01L23/04 ; H01L23/34 ; H01L23/52 ; H01L21/44 ; H01L23/66 ; H01L23/00
摘要：
A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.
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