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发明授权
US08912811B2 Test contact system for testing integrated circuits with packages having an array of signal and power contacts 有权
用于测试具有信号和电源触点阵列的封装的集成电路的测试接触系统

Test contact system for testing integrated circuits with packages having an array of signal and power contacts
摘要：
A test fixture (120) is disclosed for electrically testing a device under test (130) by forming a plurality of temporary mechanical and electrical connections between terminals (131) on the device under test (130) and contact pads (161) on the load board (160). The test fixture (120) has a replaceable membrane (150) that includes vias (151), with each via (151) being associated with a terminal (131) on the device under test (130) and a contact pad (161) on the load board (160). In some cases, each via (151) has an electrically conducting wall for conducting current between the terminal (131) and the contact pad (161). In some cases, each via (151) includes a spring (152) that provides a mechanical resisting force to the terminal (131) when the device under test (130) is engaged with the test fixture (120).
摘要（中）：

公开了一种测试夹具（120），用于通过在被测器件（130）上的端子（131）和负载上的接触焊盘（161）之间形成多个临时机械和电气连接来电测试被测器件（130） 板（160）。 测试夹具（120）具有包括过孔（151）的可更换膜（150），每个通孔（151）与被测试设备（130）上的端子（131）和接触垫 负载板（160）。 在一些情况下，每个通孔（151）具有用于在端子（131）和接触焊盘（161）之间传导电流的导电壁。 在一些情况下，每个通孔（151）包括弹簧（152），当被测试装置（130）与测试夹具（120）接合时，弹簧（152）向端子（131）提供机械阻力。

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