发明授权
- 专利标题： Mount board and electronic device
- 专利标题（中）： 安装板和电子设备
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申请号： US14016707申请日： 2013-09-03
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公开(公告)号： US08913398B2公开(公告)日： 2014-12-16
- 发明人: Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
- 申请人： Shinji Watanabe , Nobuhiro Mikami , Junya Sato , Kenichiro Fujii , Katsumi Abe , Atsumasa Sawada
- 申请人地址： JP Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Sughrue Mion, PLLC
- 优先权： JP2005-334649 20051118
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H05K3/00 ; H01L23/00 ; H05K1/02 ; H05K1/18 ; H05K3/46 ; H05K3/32
摘要：
An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.
公开/授权文献
- US20140003015A1 MOUNT BOARD AND ELECTRONIC DEVICE 公开/授权日：2014-01-02