发明授权
- 专利标题： Method and system for handling substrates
- 专利标题（中）： 处理基板的方法和系统
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申请号： US13098296申请日： 2011-04-29
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公开(公告)号： US08914143B1公开(公告)日： 2014-12-16
- 发明人: Jeffrey Kaskey , Thomas Laidig , Dave Markle , Jang-Fung Chen
- 申请人： Jeffrey Kaskey , Thomas Laidig , Dave Markle , Jang-Fung Chen
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Silicon Valley Patent Group LLP
- 代理商 Thomas Chan
- 主分类号： G06F19/00
- IPC分类号： G06F19/00 ; G03F9/00
摘要：
System and method for handling substrates in a lithography manufacturing process are disclosed. In one embodiment, a system for handling substrates in a lithography manufacturing process includes a plurality of porous chucks positioned above a substrate for imaging, a plurality of pressure sources configured to apply pressured air towards the substrate through the plurality of porous chucks, a plurality of vacuums configured to apply suction force away from the substrate, and a controller with control logic configured to hold the substrate in place by controlling the pressured air applied by the plurality of pressure sources and the suction force generated by the plurality of vacuums.