发明授权
- 专利标题： Semiconductor devices, packaging methods and structures
- 专利标题（中）： 半导体器件，封装方法和结构
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申请号： US13194606申请日： 2011-07-29
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公开(公告)号： US08916969B2公开(公告)日： 2014-12-23
- 发明人: Yu-Ren Chen , Ming Hung Tseng , Yi-Jen Lai
- 申请人： Yu-Ren Chen , Ming Hung Tseng , Yi-Jen Lai
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L23/16 ; H01L23/00 ; H01L23/31 ; H01L21/56
摘要：
Semiconductor devices, packaging methods and structures are disclosed. In one embodiment, a semiconductor device includes an integrated circuit die with a surface having a peripheral region and a central region. A plurality of bumps is disposed on the surface of the integrated circuit die in the peripheral region. A spacer is disposed on the surface of the integrated circuit die in the central region.
公开/授权文献
- US20130026623A1 Semiconductor Devices, Packaging Methods and Structures 公开/授权日：2013-01-31
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