Invention Grant
US08921711B2 Wiring substrate and electronic device 有权
接线基板和电子设备

  • Patent Title: Wiring substrate and electronic device
  • Patent Title (中): 接线基板和电子设备
  • Application No.: US13813629
    Application Date: 2011-07-07
  • Publication No.: US08921711B2
    Publication Date: 2014-12-30
  • Inventor: Hisashi Ishida
  • Applicant: Hisashi Ishida
  • Applicant Address: JP Tokyo
  • Assignee: NEC Corporation
  • Current Assignee: NEC Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: McGinn IP Law Group, PLLC
  • Priority: JP2010-220529 20100930
  • International Application: PCT/JP2011/003894 WO 20110707
  • International Announcement: WO2012/042711 WO 20120405
  • Main IPC: H05K9/00
  • IPC: H05K9/00 H05K1/02
Wiring substrate and electronic device
Abstract:
Leakage of electromagnetic noise from a wiring substrate is suppressed. A wiring substrate (1) includes a multilayered wiring layer, a structure (8) of a conductor, and an electromagnetic wave absorber (5). An electronic component (2) which is an example of an electromagnetic noise generation source is mounted on the wiring substrate (1). The electronic component (2) has a high-frequency circuit. The structure (8) is formed using the multilayered wiring layer, and is arranged so as to enclose the electronic component (2) in plan view with an opening (4) in the enclosure. The electromagnetic wave absorber (5) is arranged so as to cover the opening (4).
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