发明授权
- 专利标题: Decoupling device and fabricating method thereof
- 专利标题(中): 去耦装置及其制造方法
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申请号: US13350813申请日: 2012-01-15
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公开(公告)号: US08922976B2公开(公告)日: 2014-12-30
- 发明人: Yi-Hsiu Pan , Yu-Ting Cheng , Li-Duan Tsai , Chi-Lun Chen , Cheng-Liang Cheng
- 申请人: Yi-Hsiu Pan , Yu-Ting Cheng , Li-Duan Tsai , Chi-Lun Chen , Cheng-Liang Cheng
- 申请人地址: TW Hsinchu
- 专利权人: Industrial Technology Research Institute
- 当前专利权人: Industrial Technology Research Institute
- 当前专利权人地址: TW Hsinchu
- 代理机构: Jianq Chyun IP Office
- 优先权: TW100141045A 20111110
- 主分类号: H01G4/228
- IPC分类号: H01G4/228 ; H01G5/38 ; H01G9/048 ; H01G9/15 ; H01G9/26 ; H01G9/08
摘要:
A decoupling device including a lead frame, multiple capacitor units, a protective layer and a packaging element is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions disposed at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor units are connected in parallel and disposed on the lead frame. Each capacitor unit has a cathode portion and an opposite anode portion. The cathode portion is electrically connected with the cathode terminal portion. The anode portion is electrically connected with the anode terminal portion. The protective layer wraps at least one of the anode portion and the cathode portion of the capacitor unit. The packaging element covers the lead frame, the capacitor units and the protective layer. The packaging element exposes a bottom surface of the lead frame.
公开/授权文献
- US20130120903A1 DECOUPLING DEVICE AND FABRICATING METHOD THEREOF 公开/授权日:2013-05-16
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