Invention Grant
- Patent Title: Data signal transceiver circuitry for providing simultaneous bi-directional communication via a common conductor pair
- Patent Title (中): 用于通过公共导体对提供同时双向通信的数据信号收发器电路
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Application No.: US13045301Application Date: 2011-03-10
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Publication No.: US08923166B2Publication Date: 2014-12-30
- Inventor: Vijaya G. Ceekala , Qingping Zheng , Min Du , Xin Liu , Chandrakumar R. Pathi
- Applicant: Vijaya G. Ceekala , Qingping Zheng , Min Du , Xin Liu , Chandrakumar R. Pathi
- Applicant Address: US CA Santa Clara
- Assignee: National Semiconductor Corporation
- Current Assignee: National Semiconductor Corporation
- Current Assignee Address: US CA Santa Clara
- Agent Andrew Viger; Frederick J. Telecky, Jr.
- Main IPC: H04B1/56
- IPC: H04B1/56 ; H04L25/49 ; H04L5/14 ; H04L25/02
Abstract:
Interface circuitry and method for transmitting and receiving downstream and upstream data signals simultaneously via a common conductor pair. The composite signal containing the downstream and upstream data signal components being conveyed by the common conductor pair is isolated, e.g., via signal filtering or buffering, and combined with an appropriately scaled inverse replica of the outgoing upstream data signal to subtract out upstream data signal components and thereby provide the downstream data signal substantially free of any upstream data signal components.
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