发明授权
- 专利标题: Working electrode design for electrochemical processing of electronic components
- 专利标题(中): 电子元器件电化学处理工作电极设计
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申请号: US13612661申请日: 2012-09-12
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公开(公告)号: US08926820B2公开(公告)日: 2015-01-06
- 发明人: Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
- 申请人: Charles L. Arvin , Raschid J. Bezama , Glen N. Biggs , Hariklia Deligianni , Tracy A. Tong
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Scully, Scott, Murphy & Presser, P.C.
- 代理商 Vazken Alexanian
- 主分类号: C25D21/00
- IPC分类号: C25D21/00 ; C25D17/02 ; C25D17/12 ; C25D7/12 ; C25D5/04 ; C25D17/00
摘要:
An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.