Provided are a double-sided adhesive tape, semiconductor packages, and methods of fabricating the packages. A method of fabricating semiconductor packages includes providing a double-sided adhesive tape on a top surface of a carrier, the double-sided adhesive tape including a first adhesive layer and a second adhesive layer stacked on the first adhesive layer, the first adhesive layer of the double-sided adhesive tape being in contact with the top surface of the carrier, adhering active surfaces of a plurality of semiconductor chips onto the second adhesive layer of the double-sided adhesive tape, separating the first adhesive layer from the second adhesive layer such that the second adhesive layer remains on the active surfaces of the semiconductor chips, patterning the second adhesive layer to form first openings that selectively expose the active surfaces of the semiconductor chips, and forming first conductive components on the second adhesive layer to fill the first openings.