Invention Grant
- Patent Title: Anti-corrosion structure for wire connecting portion
- Patent Title (中): 电线连接部分的防腐结构
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Application No.: US13814105Application Date: 2011-06-17
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Publication No.: US08927863B2Publication Date: 2015-01-06
- Inventor: Naotaka Tanikawa , Hiroko Kato , Kazumasa Kobayashi , Eiji Kojima , Hiroshi Kobayashi
- Applicant: Naotaka Tanikawa , Hiroko Kato , Kazumasa Kobayashi , Eiji Kojima , Hiroshi Kobayashi
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2010-177446 20100806
- International Application: PCT/JP2011/063897 WO 20110617
- International Announcement: WO2012/017744 WO 20120209
- Main IPC: H01R4/00
- IPC: H01R4/00 ; H02G15/04 ; H01R4/70 ; H01R4/18 ; H01R4/62

Abstract:
A terminal assembly includes a wire including a core made of metal and covered with a coating, a terminal including a wire connecting portion connected to an end portion of the wire, a sealing resin sealing the wire connecting portion, and a housing including a through hole with a front opening and a rear opening. The terminal is made of a different kind of metal from the core of the wire. The housing accommodates the terminal in the through hole. The wire connecting portion includes an exposed portion not covered with the sealing resin and unexposed portions covered with the sealing resin. The exposed portion is positioned between the unexposed portions in a front and rear direction, thereby protecting the wire connecting portion from electrolytic corrosion. The exposed portion is obtained after the sealing resin is worn by being rubbed against an inner wall of the through hole.
Public/Granted literature
- US20130126235A1 ANTI-CORROSION STRUCTURE FOR WIRE CONNECTING PORTION Public/Granted day:2013-05-23
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