发明授权
US08927873B2 Fin-integrated substrate and manufacturing method of fin-integrated substrate
有权
散热一体化基板和翅片集成基板的制造方法
- 专利标题: Fin-integrated substrate and manufacturing method of fin-integrated substrate
- 专利标题(中): 散热一体化基板和翅片集成基板的制造方法
-
申请号: US13521922申请日: 2011-01-12
-
公开(公告)号: US08927873B2公开(公告)日: 2015-01-06
- 发明人: Hisashi Hori , Hideyo Osanai , Takayuki Takahashi
- 申请人: Hisashi Hori , Hideyo Osanai , Takayuki Takahashi
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: Dowa Metaltech Co., Ltd,Nippon Light Metal Company, Ltd.
- 当前专利权人: Dowa Metaltech Co., Ltd,Nippon Light Metal Company, Ltd.
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: Rader, Fishman & Grauer PLLC
- 优先权: JP2010-003630 20100112; JP2011-000386 20110105
- 国际申请: PCT/JP2011/050381 WO 20110112
- 国际公布: WO2011/087028 WO 20110721
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; H01L23/373 ; H01L23/473 ; H01L21/48
摘要:
There is provide a manufacturing method of a fin-integrated substrate capable of producing by simple process a fin-integrated substrate with heat radiating fins at fine pitches by a processing method in which warpage of a metal base plate and corrugation (wavy shape) of the heat radiating fins are suppressed. There is provided a manufacturing method of a fin-integrated substrate in which bonding of the metal circuit board to the ceramic substrate is performed by a molten metal bonding method, and formation of the plurality of heat radiating fins at a cut part that is a part of the metal base plate is performed by fixing by a jig to apply a tensile stress on a surface of the cut part where the heat radiating fins are to be formed, and performing grooving processing of forming a plurality of grooves by moving a multi-cutter composed of a plurality of stacked disc-shaped cutters, on the surface to which the tensile stress is applied, while rotating the multi-cutter.