发明授权
- 专利标题: Edge termination by ion implantation in GaN
- 专利标题(中): 通过离子注入在GaN中的边缘终止
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申请号: US13301165申请日: 2011-11-21
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公开(公告)号: US08927999B2公开(公告)日: 2015-01-06
- 发明人: Isik C. Kizilyalli , Hui Nie , Andrew P. Edwards , Linda Romano , David Bour , Richard J. Brown , Thomas R. Prunty
- 申请人: Isik C. Kizilyalli , Hui Nie , Andrew P. Edwards , Linda Romano , David Bour , Richard J. Brown , Thomas R. Prunty
- 申请人地址: US CA San Jose
- 专利权人: Avogy, Inc.
- 当前专利权人: Avogy, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 主分类号: H01L29/20
- IPC分类号: H01L29/20 ; H01L21/265 ; H01L29/66 ; H01L29/808 ; H01L29/868 ; H01L29/872 ; H01L29/06
摘要:
An edge terminated semiconductor device is described including a GaN substrate; a doped GaN epitaxial layer grown on the GaN substrate including an ion-implanted insulation region, wherein the ion-implanted region has a resistivity that is at least 90% of maximum resistivity and a conductive layer, such as a Schottky metal layer, disposed over the GaN epitaxial layer, wherein the conductive layer overlaps a portion of the ion-implanted region. A Schottky diode is prepared using the Schottky contact structure.
公开/授权文献
- US20130126888A1 Edge Termination by Ion Implantation in GaN 公开/授权日:2013-05-23
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