发明授权
- 专利标题： Light emitting device package comprising a lead electrode exposed to a recessed bottom portion of the package body
- 专利标题（中）： 发光器件封装，包括暴露于封装主体的凹陷底部的引线电极
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申请号： US13114946申请日： 2011-05-24
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公开(公告)号： US08928008B2公开(公告)日： 2015-01-06
- 发明人: Wan Ho Kim , Jun Seok Park
- 申请人： Wan Ho Kim , Jun Seok Park
- 申请人地址： KR Seoul
- 专利权人： LG Innotek Co., Ltd.
- 当前专利权人： LG Innotek Co., Ltd.
- 当前专利权人地址： KR Seoul
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： KR10-2008-0117579 20081125
- 主分类号： H01L27/15
- IPC分类号： H01L27/15
摘要：
A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead electrode, at least a portion of which is disposed within the second cavity; a second lead electrode, at least a portion of which is disposed within the first cavity; a light emitting device disposed within the second cavity; a first wire disposed within the second cavity, the first wire electrically connecting the light emitting device to the first lead electrode; and a second wire electrically connecting the light emitting device to the second lead electrode.
公开/授权文献
- US20110220949A1 LIGHT EMITTING DEVICE PACKAGE 公开/授权日：2011-09-15
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